Materials / PCB Board
PCB Board FR-4, 2 copper planes (JEDEC high-K 2s2p) strength, stiffness, density and thermal properties, with their source.
A panel in PCB Board FR-4, 2 copper planes, woven, clear-coated finish.
Mechanical Yield strength not given (tensile used) Ultimate tensile strength the bare laminate's 246–385 MPa Elongation at break not sourced Young's modulus (stiffness) the bare laminate's 21.9–25.8 GPa Density not sourced Strength to weight not sourced Stiffness to weight not sourced Poisson's ratio the bare laminate's 0.171–0.177 Shear modulus 10.2 GPa Bulk modulus 12.2 GPa Speed of sound not sourced
1k 10k 0.1 1 10 100 Density (kg/m³) Young's modulus (GPa) Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C10100 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM ASA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Stiffness against densityHigher and further left: stiffer for its weight 1k 10k 10 100 1k Density (kg/m³) Yield strength (MPa) Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Rubber Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C10100 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM ASA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLA Resin Elastic 50A SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Brick PCB Laminate FR-4 Silicon Ceramic Alumina 96% Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Strength against densityHigher and further left: stronger for its weight
Thermal Thermal conductivity not sourced Thermal expansion the bare laminate's 13–14 µm/m·K 100 mm part over a 50 °C swing 67.5 µm growth Specific heat not sourced Heats up and cools (diffusivity) not sourced Thermal shock resistance not sourced
1k 10k 0.1 1 10 100 Density (kg/m³) Thermal conductivity (W/m·K) Plastic PLA Plastic PETG Plastic ABS Plastic Nylon Rubber Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C10100 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM ASA FDM Polycarbonate FDM HIPS SLA Resin Standard DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Thermal conductivity against densityHigher and further left: spreads more heat for its weight 0.1 1 10 100 10 100 Thermal conductivity (W/m·K) Thermal expansion (µm/m·K) Plastic PETG Plastic ABS Plastic Nylon Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C10100 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM ASA FDM Polycarbonate FDM HIPS SLA Resin Standard DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick Plywood PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Thermal expansion against thermal conductivityLower and further right: warps less when heated
Sources 1 document: Isola
Values for Composite. A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. 1 370HR Laminate and Prepreg Data Sheet Isola archived copy Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) Thermal properties of PCB Board FR-4, 2 copper planes Coefficient of thermal expansion of PCB Board FR-4, 2 copper planes PCB Board FR-4, 2 copper planes expands 13–14 µm/m·K (7.22–7.78 µin/in·°F): a 100 mm part grows 67.5 µm over a 50 °C rise. Basis: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C). Source: Isola, 370HR Laminate and Prepreg Data Sheetarchived copy .
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