Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Kaiser Aluminum, Isola, U.S. Department of Defense
Aluminum 6061-T6
6061-T6/T651, Kaiser Aluminum typical properties; Poisson from MIL-HDBK-5J
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
1
Alloy 6061 Sheet, Coil & Plate Technical DataKaiser Aluminumarchived copyAluminum 6061-T6 · Yield strength: typical, 0.2% offset, .500 in dia specimenAluminum 6061-T6 · Ultimate tensile strength: typicalAluminum 6061-T6 · Elongation at break: typical, in 4D, 0.500 in dia specimenAluminum 6061-T6 · Young's modulus (stiffness): typicalAluminum 6061-T6 · Density: nominalAluminum 6061-T6 · Thermal conductivity: typical, 20 °CAluminum 6061-T6 · Thermal expansion: typical, mean 20-100 °CAluminum 6061-T6 · Specific heat: typical, at 100 °CAluminum 6061-T6 · Melting point: solidus-liquidus
2
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
3
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseAluminum 6061-T6 · Poisson's ratio: typical (handbook physical constant)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum 6061-T6 stronger than PCB Board FR-4, 2 copper planes?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 276 MPa for Aluminum 6061-T6 (14%).
Which is stiffer, Aluminum 6061-T6 or PCB Board FR-4, 2 copper planes?
Aluminum 6061-T6 is stiffer: Young's modulus 68.3 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Aluminum 6061-T6 deflects less under the same load.
Thermal
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 23.6 µm/m·K for Aluminum 6061-T6.