Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Try it on a partA sample part to run stress or thermal on, free in your browser
Sources5 documents: EOS GmbH, Isola, Renishaw, U.S. Department of Defense
DMLS AlSi10Mg Aluminum
EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
1
EOS Aluminium AlSi10Mg Material Data SheetEOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Yield strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Ultimate tensile strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Elongation at break: typical at break, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Thermal conductivity: typical, as manufactured, horizontal (ISO 22007-2)DMLS AlSi10Mg Aluminum · Thermal expansion: mean 25-100 °C, ASTM E228
2
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
3
RenAM 500 Series Aluminium AlSi10Mg Material Data SheetRenishawDMLS AlSi10Mg Aluminum · Young's modulus (stiffness): same material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY)
4
EOS Aluminium AlSi10Mg Material Data Sheet, FlexLine, M 290 (2018)EOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Density: typical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm)
5
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseDMLS AlSi10Mg Aluminum · Poisson's ratio: base material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000)DMLS AlSi10Mg Aluminum · Specific heat: base material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is DMLS AlSi10Mg Aluminum stronger than PCB Board FR-4, 2 copper planes?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 270 MPa for DMLS AlSi10Mg Aluminum (17%).
Which is stiffer, DMLS AlSi10Mg Aluminum or PCB Board FR-4, 2 copper planes?
DMLS AlSi10Mg Aluminum is stiffer: Young's modulus 72 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in DMLS AlSi10Mg Aluminum deflects less under the same load.
Thermal
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 20 µm/m·K for DMLS AlSi10Mg Aluminum.