Materials / Compare

PCB Board FR-4, 2 copper planes vs. Plastic PPS GF40

Compare PCB Board FR-4, 2 copper planes vs. Plastic PPS GF40 strength, stiffness, weight and thermal properties.

PCB Board FR-4, 2 copper planesComposite
Plastic PPS GF40Bulk polymer (molded or machined)
MechanicalPCB Board FR-4, 2 copper planesPlastic PPS GF40
Yield strengthnot given (tensile used)not given (tensile used)
Ultimate tensile strengththe bare laminate's246–385MPa1tensile strength195MPa2
Flexural strengthnot sourced285MPa2
Elongation at breaknot sourcedstrain at break1.9%2
Young's modulus (stiffness)the bare laminate's21.9–25.8GPa114.7GPa2
Densitynot sourced1,650kg/m³2
Strength to weightnot sourced118kN·m/kg
Stiffness to weightnot sourced8.91MN·m/kg
Poisson's ratiothe bare laminate's0.171–0.17710.353
Shear modulus10.2GPa1.87x stiffer in shear5.44GPa
Bulk modulus12.2GPa16.3GPa34% higher
Speed of soundnot sourced2,985m/s
1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcretePCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic LCP GF30Plastic PPS GF40
Stiffness against densityHigher and further left: stiffer for its weight
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic LCP GF30Plastic PPS GF40
Strength against densityHigher and further left: stronger for its weight
ThermalPCB Board FR-4, 2 copper planesPlastic PPS GF40
Thermal conductivitynot sourced0.2W/m·K3
Thermal expansionthe bare laminate's13–14µm/m·K1parallel12µm/m·K2
100 mm part over a 50 °C swing67.5µm growth60µm growth12% less
Specific heatnot sourcednot sourced
Heats up and cools (diffusivity)not sourcednot sourced
Thermal shock resistancenot sourced144W/m
Melting pointnot sourcedDSC280°C2
Glass transitionnot sourcedDSC90°C2
Max service temperaturenot sourcedHDT 1.8 MPa270°C2
1k10k0.1110100Density (kg/m³)Thermal conductivity (W/m·K)Plastic PLAPlastic PETGPlastic ABSPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic LCP GF30Plastic PPS GF40
Thermal conductivity against densityHigher and further left: spreads more heat for its weight
0.111010010100Thermal conductivity (W/m·K)Thermal expansion (µm/m·K)Plastic PETGPlastic ABSPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPlywoodPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic LCP GF30Plastic PPS GF40
Thermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Isola, Celanese
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
Plastic PPS GF40
Celanese Fortron 1140L4 (PPS, 40% glass fibre), injection moulding; FORTRON PPS Short-Term Properties Guide (PPS-012, 2016); thermal conductivity and Poisson for 40% glass-reinforced Fortron from the Fortron PPS Design Manual (PPS-050, 2013).
  1. 1
    370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
  2. 2
    Fortron PPS Short-Term Properties Guide (PPS-012)CelanesePlastic PPS GF40 · Ultimate tensile strength: tensile strength, 5 mm/minPlastic PPS GF40 · Flexural strength: flexural strength at breakPlastic PPS GF40 · Elongation at break: strain at break, 5 mm/minPlastic PPS GF40 · Young's modulus (stiffness): typical, 1 mm/minPlastic PPS GF40 · Density: typicalPlastic PPS GF40 · Thermal expansion: parallel (flow), mean -50 to 90 °CPlastic PPS GF40 · Melting point: DSC, 10 °C/minPlastic PPS GF40 · Glass transition: DSC, 10 °C/minPlastic PPS GF40 · Max service temperature: HDT 1.8 MPa
  3. 3
    Fortron PPS Design Manual (PPS-050)CelanesePlastic PPS GF40 · Poisson's ratio: glass-reinforced Fortron PPS (class value, not grade-specific)Plastic PPS GF40 · Thermal conductivity: 40% glass-reinforced Fortron, 25 °C (not grade-specific)

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Mechanical

Is PCB Board FR-4, 2 copper planes stronger than Plastic PPS GF40?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against 195 MPa for Plastic PPS GF40 (1.62x).

Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic PPS GF40?

PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 14.7 GPa for Plastic PPS GF40, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.

Thermal

Which expands less with temperature?

Plastic PPS GF40 expands less: 12 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.

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