Materials / Compare

Magnesium AZ31B-H24 vs. PCB Board FR-4, 2 copper planes

Compare Magnesium AZ31B-H24 vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

Magnesium AZ31B-H24Wrought
PCB Board FR-4, 2 copper planesComposite
MechanicalMagnesium AZ31B-H24PCB Board FR-4, 2 copper planes
Yield strength220MPa1not given (tensile used)
Ultimate tensile strength290MPa1the bare laminate's246–385MPa2
Elongation at break13%1not sourced
Young's modulus (stiffness)44.8GPa3the bare laminate's21.9–25.8GPa2
Density1,769kg/m³3not sourced
Strength to weight124kN·m/kgnot sourced
Stiffness to weight25.3MN·m/kgnot sourced
Poisson's ratio0.353the bare laminate's0.171–0.1772
Shear modulus16.6GPa1.63x stiffer in shear10.2GPa
Bulk modulus49.8GPa4.08x higher12.2GPa
Speed of sound5,032m/snot sourced
1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcretePCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Magnesium AZ31B-H24
Stiffness against densityHigher and further left: stiffer for its weight
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Magnesium AZ31B-H24
Strength against densityHigher and further left: stronger for its weight
ThermalMagnesium AZ31B-H24PCB Board FR-4, 2 copper planes
Thermal conductivity76.9W/m·K1not sourced
Thermal expansion26.8µm/m·K1the bare laminate's13–14µm/m·K2
100 mm part over a 50 °C swing134µm growth67.5µm growth1.99x less
Specific heat1,040J/kg·K1not sourced
Heats up and cools (diffusivity)41.8mm²/snot sourced
Thermal shock resistance9,159W/mnot sourced
Max service temperature149°C3not sourced
1k10k0.1110100Density (kg/m³)Thermal conductivity (W/m·K)Plastic PLAPlastic PETGPlastic ABSPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Magnesium AZ31B-H24
Thermal conductivity against densityHigher and further left: spreads more heat for its weight
0.111010010100Thermal conductivity (W/m·K)Thermal expansion (µm/m·K)Plastic PETGPlastic ABSPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPlywoodPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Magnesium AZ31B-H24
Thermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Magnesium Elektron, Isola, U.S. Department of Defense
Magnesium AZ31B-H24
AZ31B-H24 sheet 0.016-0.062 in., MIL-HDBK-5J Table 4.2.1.0(b) (AMS 4377); strengths are S-basis MINIMUMS
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
  1. 1
    Elektron AZ31B Sheet, Plate & Coil (Datasheet 482)Magnesium Elektronarchived copyMagnesium AZ31B-H24 · Yield strength: typical, H24, 0.5-6 mm, 0.2 % proof stressMagnesium AZ31B-H24 · Ultimate tensile strength: typical, H24, 0.5-6 mmMagnesium AZ31B-H24 · Elongation at break: typical, H24, 0.5-6 mm, gauge 5.65√AMagnesium AZ31B-H24 · Thermal conductivity: typical (temper/temperature not stated)Magnesium AZ31B-H24 · Thermal expansion: typical (temperature range not stated)Magnesium AZ31B-H24 · Specific heat: typical
  2. 2
    370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
  3. 3
    MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseMagnesium AZ31B-H24 · Young's modulus (stiffness): typical (handbook physical constant)Magnesium AZ31B-H24 · Density: nominalMagnesium AZ31B-H24 · Poisson's ratio: typical (handbook physical constant)Magnesium AZ31B-H24 · Max service temperature: stated application limit

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Mechanical

Is Magnesium AZ31B-H24 stronger than PCB Board FR-4, 2 copper planes?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 220 MPa for Magnesium AZ31B-H24 (43%).

Which is stiffer, Magnesium AZ31B-H24 or PCB Board FR-4, 2 copper planes?

Magnesium AZ31B-H24 is stiffer: Young's modulus 44.8 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Magnesium AZ31B-H24 deflects less under the same load.

Thermal

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 26.8 µm/m·K for Magnesium AZ31B-H24.

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