SLA Resin Standard vs. Solder SAC305

Compare SLA Resin Standard vs. Solder SAC305 strength, stiffness, weight and thermal properties.

SLA Resin Standard3D printed (SLA resin)

Mechanical	SLA Resin Standard	Solder SAC305
Yield strength	not given (tensile used)	22MPa1
Ultimate tensile strength	60MPa21.52x stronger	39.6MPa1
Flexural strength	105MPa2	not sourced
Elongation at break	8%2	49%16.13x more ductile
Young's modulus (stiffness)	2.75GPa2	6.9GPa12.51x stiffer
Density	1,210kg/m³36.07x lighter	7,350kg/m³1
Strength to weight	49.6kN·m/kg16.6x higher	2.99kN·m/kg
Stiffness to weight	2.27MN·m/kg2.42x higher	0.939MN·m/kg
Poisson's ratio	not sourced	0.351
Shear modulus	not sourced	2.56GPa
Bulk modulus	not sourced	7.67GPa
Speed of sound	1,508m/s1.56x faster	969m/s

Stiffness against densityHigher and further left: stiffer for its weight

Strength against densityHigher and further left: stronger for its weight

Thermal	SLA Resin Standard	Solder SAC305
Thermal conductivity	0.54W/m·K4	61W/m·K1113x more heat through a fin
Thermal expansion	mean -30 to 140 °C114µm/m·K4	mean21.9µm/m·K55.21x less
100 mm part over a 50 °C swing	571µm growth	110µm growth5.21x less
Specific heat	1,800J/kg·K47.76x higher	232J/kg·K5
Heats up and cools (diffusivity)	0.248mm²/s	35.8mm²/s144x faster
Thermal shock resistance	not sourced	5,773W/m
Melting point	not sourced	solidus-liquidus217–220°C1
Max service temperature	HDT 1.8 MPa59°C2	not sourced

Thermal conductivity against densityHigher and further left: spreads more heat for its weight

Thermal expansion against thermal conductivityLower and further right: warps less when heated

Try it on a partA bracket to run stress or thermal on, free in your browser	Open in LessCAD	Open in LessCAD

Sources5 documents: Indium Corporation, Formlabs, MacDermid Alpha

SLA Resin Standard: Formlabs Clear Resin V5 (FLGPCL05), TDS Rev. 01 March 20, 2024; printed on Form 4 at 100 µm, washed 5 min in >=99% IPA, post-cured 15 min at 60 °C in Form Cure. Orientation not stated.
Solder SAC305: SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).

1
Indalloy 256 (SAC305) for Preforms Product Data Sheet (100346 R0)Indium Corporationarchived copySolder SAC305 · Yield strength: typicalSolder SAC305 · Ultimate tensile strength: typicalSolder SAC305 · Elongation at break: typicalSolder SAC305 · Young's modulus (stiffness): typical, temperature and strain rate not statedSolder SAC305 · Density: typicalSolder SAC305 · Poisson's ratio: typicalSolder SAC305 · Thermal conductivity: typical, temperature not statedSolder SAC305 · Melting point: solidus-liquidus
2
Clear Resin V5 Technical Data Sheet (2024)Formlabsarchived copySLA Resin Standard · Ultimate tensile strength: typicalSLA Resin Standard · Flexural strength: typicalSLA Resin Standard · Elongation at break: typicalSLA Resin Standard · Young's modulus (stiffness): typicalSLA Resin Standard · Max service temperature: HDT 1.8 MPa
3
Clear Resin V5 Technical Data Sheet (web edition)FormlabsSLA Resin Standard · Density: typical, post-cured (same for 5 min ambient and 15 min at 60 °C), ASTM D792
4
Thermal Properties of Selected Formlabs SLA ResinsFormlabsSLA Resin Standard · Thermal conductivity: typical, post-cured, ASTM E1530SLA Resin Standard · Thermal expansion: mean -30 to 140 °C, post-cured (5 min ambient cure), TMA ASTM E831SLA Resin Standard · Specific heat: typical, 25 °C, post-cured (5 min ambient cure), DSC ASTM E1269
5
ALPHA Vaculoy SAC Alloys Technical Data Sheet (2023)MacDermid AlphaSolder SAC305 · Thermal expansion: mean, 20-100 °C (MacDermid Alpha)Solder SAC305 · Specific heat: typical (MacDermid Alpha)

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

SLA Resin Standard is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Mechanical

Is SLA Resin Standard stronger than Solder SAC305?

SLA Resin Standard is stronger: its tensile strength is 60 MPa against yield strength 22 MPa for Solder SAC305 (2.73x).

Which is lighter, SLA Resin Standard or Solder SAC305?

SLA Resin Standard is lighter: 1,210 kg/m³ against 7,350 kg/m³ for Solder SAC305.

Which is stiffer, SLA Resin Standard or Solder SAC305?

Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 2.75 GPa for SLA Resin Standard, so the same part in Solder SAC305 deflects less under the same load.

Which is lighter for the same job, SLA Resin Standard or Solder SAC305?

For the same stiffness or strength: SLA Resin Standard is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.

Part that must be	SLA Resin Standard	Solder SAC305
Stiff rod or tie (tension)	lighter	2.42x heavier
Stiff beam (bending)	lighter	3.83x heavier
Stiff panel or plate	lighter	4.47x heavier
Strong rod or tie	lighter	16.6x heavier
Strong beam	lighter	11.9x heavier
Strong panel or plate	lighter	10x heavier

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which is more ductile, SLA Resin Standard or Solder SAC305?

Solder SAC305 stretches further before it breaks: 49% elongation at break against 8% for SLA Resin Standard.

Thermal

Which conducts heat better, SLA Resin Standard or Solder SAC305?

Solder SAC305 conducts heat better: 61 W/m·K against 0.54 W/m·K for SLA Resin Standard.

Which expands less with temperature?

Solder SAC305 expands less: 21.9 µm/m·K against 114 µm/m·K for SLA Resin Standard.