Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Try it on a partA sample part to run stress or thermal on, free in your browser
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
1
Indalloy 256 (SAC305) for Preforms Product Data Sheet (100346 R0)Indium Corporationarchived copySolder SAC305 · Yield strength: typicalSolder SAC305 · Ultimate tensile strength: typicalSolder SAC305 · Elongation at break: typicalSolder SAC305 · Young's modulus (stiffness): typical, temperature and strain rate not statedSolder SAC305 · Density: typicalSolder SAC305 · Poisson's ratio: typicalSolder SAC305 · Thermal conductivity: typical, temperature not statedSolder SAC305 · Melting point: solidus-liquidus
2
Wood Handbook (FPL-GTR-282), Chapter 12: Mechanical Properties of Wood-Based Composite MaterialsUSDA Forest Products LaboratoryPlywood · Ultimate tensile strength: modulus of rupture (no direct tensile value)Plywood · Flexural strength: static bending MOR (Douglas-fir); range 33.72-42.61 across speciesPlywood · Young's modulus (stiffness): static bending MOE of the panel (Douglas-fir); range 6.96-8.55 across species
3
Thermal Properties of Wood and Wood Panel Products for Use in Buildings (1988)USDA Forest Products Laboratoryarchived copyPlywood · Thermal conductivity: APA-recommended design value (Douglas-fir plywood), as reported by FPL/ORNL
4
Wood Handbook (FPL-GTR-282), Chapter 4: Moisture Relations and Physical Properties of WoodUSDA Forest Products LaboratoryPlywood · Thermal expansion: base material: solid wood parallel to grain, ovendry, range across speciesPlywood · Specific heat: base material: solid wood (all species), 12% MC, 27 C
5
ALPHA Vaculoy SAC Alloys Technical Data Sheet (2023)MacDermid AlphaSolder SAC305 · Thermal expansion: mean, 20-100 °C (MacDermid Alpha)Solder SAC305 · Specific heat: typical (MacDermid Alpha)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Plywood stronger than Solder SAC305?
Plywood is stronger: its tensile strength is 41.4 MPa against yield strength 22 MPa for Solder SAC305 (1.88x).
Which is stiffer, Plywood or Solder SAC305?
Plywood is stiffer: Young's modulus 7.45 GPa against 6.9 GPa for Solder SAC305, so the same part in Plywood deflects less under the same load.
Thermal
Which conducts heat better, Plywood or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.12 W/m·K for Plywood.
Which expands less with temperature?
Plywood expands less: 3.8 µm/m·K against 21.9 µm/m·K for Solder SAC305.