Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Ultimaker PC, 3D-printed specimens, XY (flat); Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS (file v5.00), April 20, 2022.
Solder SAC305
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
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Ultimaker PC Technical Data Sheet, v5.00UltiMakerarchived copyFDM Polycarbonate · Yield strength: typicalFDM Polycarbonate · Ultimate tensile strength: typical, peak stress (= stress at yield)FDM Polycarbonate · Flexural strength: typicalFDM Polycarbonate · Elongation at break: typicalFDM Polycarbonate · Young's modulus (stiffness): typicalFDM Polycarbonate · Density: rangeFDM Polycarbonate · Glass transition: typicalFDM Polycarbonate · Max service temperature: HDT 0.455 MPa (printed specimens)
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Indalloy 256 (SAC305) for Preforms Product Data Sheet (100346 R0)Indium Corporationarchived copySolder SAC305 · Yield strength: typicalSolder SAC305 · Ultimate tensile strength: typicalSolder SAC305 · Elongation at break: typicalSolder SAC305 · Young's modulus (stiffness): typical, temperature and strain rate not statedSolder SAC305 · Density: typicalSolder SAC305 · Poisson's ratio: typicalSolder SAC305 · Thermal conductivity: typical, temperature not statedSolder SAC305 · Melting point: solidus-liquidus
3
Engineering Polymers Part and Mold Design: Thermoplastics, A Design GuideCovestroarchived copyFDM Polycarbonate · Poisson's ratio: base material: polycarbonate family typical (Covestro Part and Mold Design guide, Table 3-1)
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Makrolon 2405 Technical Data SheetCovestroFDM Polycarbonate · Thermal conductivity: base material: Covestro Makrolon 2405 injection-molding PC, typical, through-plane, 23 °CFDM Polycarbonate · Thermal expansion: base material: Covestro Makrolon 2405 injection-molding PC, typical, 23-55 °C, parallel
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ALPHA Vaculoy SAC Alloys Technical Data Sheet (2023)MacDermid AlphaSolder SAC305 · Thermal expansion: mean, 20-100 °C (MacDermid Alpha)Solder SAC305 · Specific heat: typical (MacDermid Alpha)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM Polycarbonate is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is FDM Polycarbonate stronger than Solder SAC305?
FDM Polycarbonate is stronger: its yield strength is 53.3 MPa against 22 MPa for Solder SAC305 (2.42x).
Which is lighter, FDM Polycarbonate or Solder SAC305?
FDM Polycarbonate is lighter: 1,190 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, FDM Polycarbonate or Solder SAC305?
Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 2.39 GPa for FDM Polycarbonate, so the same part in Solder SAC305 deflects less under the same load.
Which is lighter for the same job, FDM Polycarbonate or Solder SAC305?
For the same stiffness or strength: FDM Polycarbonate is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
FDM Polycarbonate
Solder SAC305
Stiff rod or tie (tension)
lighter
2.14x heavier
Stiff beam (bending)
lighter
3.64x heavier
Stiff panel or plate
lighter
4.34x heavier
Strong rod or tie
lighter
15x heavier
Strong beam
lighter
11.1x heavier
Strong panel or plate
lighter
9.61x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, FDM Polycarbonate or Solder SAC305?
Solder SAC305 stretches further before it breaks: 49% elongation at break against 9.2% for FDM Polycarbonate.
Thermal
Which conducts heat better, FDM Polycarbonate or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.2 W/m·K for FDM Polycarbonate.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 65 µm/m·K for FDM Polycarbonate.