Materials / Silicon

Silicon

Silicon (single crystal) strength, stiffness, density and thermal properties, with their source.

A panel in Silicon, smooth finish.

Mechanical
Yield strengthnone (brittle)
Ultimate tensile strengthmodulus of rupture130MPa1
Flexural strengthmodulus of rupture130MPa1
Elongation at breaknone (brittle)
Young's modulus (stiffness)131GPa1
Density2,329kg/m³1
Strength to weight55.8kN·m/kg
Stiffness to weight56.2MN·m/kg
Poisson's ratio0.2211
Shear modulus53.6GPa
Bulk modulus78.3GPa
Speed of sound7,500m/s
1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcretePCB Laminate FR-4Ceramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Silicon
Stiffness against densityHigher and further left: stiffer for its weight
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4Ceramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Silicon
Strength against densityHigher and further left: stronger for its weight
Thermal
Thermal conductivity163W/m·K1
Thermal expansion2.62µm/m·K1
100 mm part over a 50 °C swing13.1µm growth
Specific heat732J/kg·K1
Heats up and cools (diffusivity)95.6mm²/s
Thermal shock resistance48,095W/m
Melting point1,412°C1
Max service temperature300°C1
1k10k0.1110100Density (kg/m³)Thermal conductivity (W/m·K)Plastic PLAPlastic PETGPlastic ABSPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPCB Laminate FR-4Ceramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Silicon
Thermal conductivity against densityHigher and further left: spreads more heat for its weight
0.111010010100Thermal conductivity (W/m·K)Thermal expansion (µm/m·K)Plastic PETGPlastic ABSPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPlywoodPCB Laminate FR-4Ceramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Silicon
Thermal expansion against thermal conductivityLower and further right: warps less when heated
Sources1 document: Korth Kristalle
Values for
Grown single crystal. Synthetic single-crystal silicon (cubic, diamond structure), Korth Kristalle (crystal grower) material data; Korth usually supplies Floating Zone (FZ) material, Czochralski (Cz) also offered. Silicon is elastically anisotropic; the producer quotes one modulus and the solver is isotropic.
  1. 1
    Si: SiliconKorth Kristallearchived copyUltimate tensile strength: modulus of rupture (bending fracture stress); brittle, no yield pointFlexural strength: modulus of ruptureYoung's modulus (stiffness): typical (single quoted value of an anisotropic crystal)Density: typicalPoisson's ratio: typicalThermal conductivity: typical at 313 K (40 °C)Thermal expansion: typical at 300 KSpecific heat: typicalMelting point: typicalMax service temperature: producer's maximum application temperature (optical components)

Thermal properties of Silicon

Thermal conductivity of Silicon

Silicon has a thermal conductivity of 163 W/m·K (94.2 BTU/hr·ft·°F). Basis: typical at 313 K (40 °C). Source: Korth Kristalle, Si: Siliconarchived copy.

Specific heat of Silicon

The specific heat capacity of Silicon is 732 J/kg·K (0.175 BTU/lb·°F). Basis: typical. Source: Korth Kristalle, Si: Siliconarchived copy.

Coefficient of thermal expansion of Silicon

Silicon expands 2.62 µm/m·K (1.46 µin/in·°F): a 100 mm part grows 13.1 µm over a 50 °C rise. Basis: typical at 300 K. Source: Korth Kristalle, Si: Siliconarchived copy.

Thermal diffusivity of Silicon

Computed from the conductivity, density and specific heat (k / ρc): 95.6 mm²/s, how fast a temperature change spreads through it.

Melting point of Silicon

Silicon melts at 1,412 °C (2,574 °F). Basis: typical. Source: Korth Kristalle, Si: Siliconarchived copy.

Maximum service temperature of Silicon

The maximum service temperature of Silicon is 300 °C (572 °F). Basis: producer's maximum application temperature (optical components). Source: Korth Kristalle, Si: Siliconarchived copy.

Compare Silicon with