Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Kaiser Aluminum, Korth Kristalle, U.S. Department of Defense
Aluminum 5052-H32
5052-H32, Kaiser Aluminum tube & pipe typical datasheet (mechanical, CTE, melting); MIL-HDBK-5J (Poisson, density, specific heat)
Silicon
Synthetic single-crystal silicon (cubic, diamond structure), Korth Kristalle (crystal grower) material data; Korth usually supplies Floating Zone (FZ) material, Czochralski (Cz) also offered. Silicon is elastically anisotropic; the producer quotes one modulus and the solver is isotropic.
1
Alloy 5052 Tube & Pipe Technical DataKaiser Aluminumarchived copyAluminum 5052-H32 · Yield strength: typical, 0.2% offsetAluminum 5052-H32 · Ultimate tensile strength: typicalAluminum 5052-H32 · Elongation at break: typicalAluminum 5052-H32 · Young's modulus (stiffness): typicalAluminum 5052-H32 · Thermal conductivity: base material: 5052 in O temper (same alloy, annealed); Kaiser typicalAluminum 5052-H32 · Thermal expansion: typical, mean 20-100 °CAluminum 5052-H32 · Melting point: melting range
2
Si: SiliconKorth Kristallearchived copySilicon · Ultimate tensile strength: modulus of rupture (bending fracture stress); brittle, no yield pointSilicon · Flexural strength: modulus of ruptureSilicon · Young's modulus (stiffness): typical (single quoted value of an anisotropic crystal)Silicon · Density: typicalSilicon · Poisson's ratio: typicalSilicon · Thermal conductivity: typical at 313 K (40 °C)Silicon · Thermal expansion: typical at 300 KSilicon · Specific heat: typicalSilicon · Melting point: typicalSilicon · Max service temperature: producer's maximum application temperature (optical components)
3
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseAluminum 5052-H32 · Density: nominalAluminum 5052-H32 · Poisson's ratio: typical (handbook physical constant)Aluminum 5052-H32 · Specific heat: at 100 °C (212 °F); table covers O, H32, H34, H36, H38
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum 5052-H32 stronger than Silicon?
Aluminum 5052-H32 is stronger: its yield strength is 195 MPa against tensile strength 130 MPa for Silicon (1.5x).
Which is lighter, Aluminum 5052-H32 or Silicon?
Silicon is lighter: 2,329 kg/m³ against 2,685 kg/m³ for Aluminum 5052-H32.
Which is stiffer, Aluminum 5052-H32 or Silicon?
Silicon is stiffer: Young's modulus 131 GPa against 70 GPa for Aluminum 5052-H32, so the same part in Silicon deflects less under the same load.
Which is lighter for the same job, Aluminum 5052-H32 or Silicon?
For the same stiffness or strength: Aluminum 5052-H32 is lighter for a strong rod or tie, strong beam, strong panel or plate; Silicon is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
Part that must be
Aluminum 5052-H32
Silicon
Stiff rod or tie (tension)
2.16x heavier
lighter
Stiff beam (bending)
1.58x heavier
lighter
Stiff panel or plate
42% heavier
lighter
Strong rod or tie
lighter
30% heavier
Strong beam
lighter
14% heavier
Strong panel or plate
lighter
6% heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Aluminum 5052-H32 or Silicon?
Silicon conducts heat better: 163 W/m·K against 138 W/m·K for Aluminum 5052-H32.
Which expands less with temperature?
Silicon expands less: 2.62 µm/m·K against 23.8 µm/m·K for Aluminum 5052-H32.