Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Sources2 documents: Copper Development Association, Wieland
Values for
Wrought. C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyYield strength: typical, 0.5% extension under load, 0.04 in. flatUltimate tensile strength: typical, 0.04 in. flatElongation at break: typical, 0.04 in. flatYoung's modulus (stiffness): typicalDensity: nominalThermal conductivity: typical, 20 °CThermal expansion: typical, mean 20-100 °CSpecific heat: typical, 20 °CMelting point: melting point (liquidus = solidus, pure copper)
2
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandPoisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Copper C10100 has a thermal conductivity of 391 W/m·K (226 BTU/hr·ft·°F). Basis: typical, 20 °C. Source: Copper Development Association, C10100 Alloy (copper.org)archived copy.
Specific heat of Copper C10100
The specific heat capacity of Copper C10100 is 385 J/kg·K (0.092 BTU/lb·°F). Basis: typical, 20 °C. Source: Copper Development Association, C10100 Alloy (copper.org)archived copy.
Coefficient of thermal expansion of Copper C10100
Copper C10100 expands 16.9 µm/m·K (9.39 µin/in·°F): a 100 mm part grows 84.5 µm over a 50 °C rise. Basis: typical, mean 20-100 °C. Source: Copper Development Association, C10100 Alloy (copper.org)archived copy.
Thermal diffusivity of Copper C10100
Computed from the conductivity, density and specific heat (k / ρc): 114 mm²/s, how fast a temperature change spreads through it.
Melting point of Copper C10100
Copper C10100 melts at 1,083 °C (1,981 °F). Basis: melting point (liquidus = solidus, pure copper). Source: Copper Development Association, C10100 Alloy (copper.org)archived copy.