Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Isola, Sumitomo Chemical, Park Electrochemical (Nelco)
PCB Laminate FR-4
Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material.
Plastic LCP GF30
Sumitomo Chemical SUMIKASUPER LCP E6006L (30% glass fibre; high strength, low shrinkage); SUMIKASUPER LCP Technical Note, Version 04 / Nov. 2023, typical values.
1
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Laminate FR-4 · Ultimate tensile strength: typical, in-plane: cross direction .. length direction (ASTM D3039)PCB Laminate FR-4 · Flexural strength: typical: cross direction .. length direction (IPC-TM-650 2.4.4B)PCB Laminate FR-4 · Young's modulus (stiffness): typical, in-plane: cross direction .. length direction (ASTM D790-15e2)PCB Laminate FR-4 · Poisson's ratio: typical, in-plane: cross direction .. length directionPCB Laminate FR-4 · Thermal conductivity: typical (ASTM E1952); direction not stated by the sheetPCB Laminate FR-4 · Thermal expansion: typical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)PCB Laminate FR-4 · Glass transition: typical, DSC (IPC-TM-650 2.4.25C)PCB Laminate FR-4 · Max service temperature: UL Relative Thermal Index (UL 796)
2
SUMIKASUPER LCP Technical Note, Version 04 (2023)Sumitomo Chemicalarchived copyPlastic LCP GF30 · Ultimate tensile strength: tensile strength (ISO 527)Plastic LCP GF30 · Flexural strength: typical (ISO 178)Plastic LCP GF30 · Elongation at break: tensile elongation (ISO 527)Plastic LCP GF30 · Young's modulus (stiffness): tensile modulus (ISO 527)Plastic LCP GF30 · Density: typicalPlastic LCP GF30 · Thermal conductivity: hot disk (ISO 22007-2), temperature not statedPlastic LCP GF30 · Thermal expansion: flow direction (MD), mean 50-150 °CPlastic LCP GF30 · Specific heat: ASTM E1269, temperature not statedPlastic LCP GF30 · Max service temperature: HDT 1.8 MPa (ISO 75)
3
N4000-6 Laminate Data Sheet (2006)Park Electrochemical (Nelco)archived copyPCB Laminate FR-4 · Density: typical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HRPCB Laminate FR-4 · Specific heat: typical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is PCB Laminate FR-4 stronger than Plastic LCP GF30?
PCB Laminate FR-4 is stronger: its tensile strength is 315 MPa against 115 MPa for Plastic LCP GF30 (2.74x).
Which is lighter, PCB Laminate FR-4 or Plastic LCP GF30?
Plastic LCP GF30 is lighter: 1,610 kg/m³ against 1,920 kg/m³ for PCB Laminate FR-4.
Which is stiffer, PCB Laminate FR-4 or Plastic LCP GF30?
PCB Laminate FR-4 is stiffer: Young's modulus 23.9 GPa against 11.5 GPa for Plastic LCP GF30, so the same part in PCB Laminate FR-4 deflects less under the same load.
Which is lighter for the same job, PCB Laminate FR-4 or Plastic LCP GF30?
For the same stiffness or strength: PCB Laminate FR-4 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
PCB Laminate FR-4
Plastic LCP GF30
Stiff rod or tie (tension)
lighter
1.74x heavier
Stiff beam (bending)
lighter
21% heavier
Stiff panel or plate
lighter
7% heavier
Strong rod or tie
lighter
2.3x heavier
Strong beam
lighter
1.64x heavier
Strong panel or plate
lighter
39% heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, PCB Laminate FR-4 or Plastic LCP GF30?
Plastic LCP GF30 conducts heat better: 0.5 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 20 µm/m·K for Plastic LCP GF30.