Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
FDM Polycarbonate
Ultimaker PC, 3D-printed specimens, XY (flat); Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS (file v5.00), April 20, 2022.
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Ultimaker PC Technical Data Sheet, v5.00UltiMakerarchived copyFDM Polycarbonate · Yield strength: typicalFDM Polycarbonate · Ultimate tensile strength: typical, peak stress (= stress at yield)FDM Polycarbonate · Flexural strength: typicalFDM Polycarbonate · Elongation at break: typicalFDM Polycarbonate · Young's modulus (stiffness): typicalFDM Polycarbonate · Density: rangeFDM Polycarbonate · Glass transition: typicalFDM Polycarbonate · Max service temperature: HDT 0.455 MPa (printed specimens)
Engineering Polymers Part and Mold Design: Thermoplastics, A Design GuideCovestroarchived copyFDM Polycarbonate · Poisson's ratio: base material: polycarbonate family typical (Covestro Part and Mold Design guide, Table 3-1)
Makrolon 2405 Technical Data SheetCovestroFDM Polycarbonate · Thermal conductivity: base material: Covestro Makrolon 2405 injection-molding PC, typical, through-plane, 23 °CFDM Polycarbonate · Thermal expansion: base material: Covestro Makrolon 2405 injection-molding PC, typical, 23-55 °C, parallel
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS and FDM Polycarbonate are 3D printed: their properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is FDM HIPS stronger than FDM Polycarbonate?
FDM Polycarbonate is stronger: its yield strength is 53.3 MPa against tensile strength 18.4 MPa for FDM HIPS (2.9x).
Which is lighter, FDM HIPS or FDM Polycarbonate?
FDM HIPS is lighter: 1,023 kg/m³ against 1,190 kg/m³ for FDM Polycarbonate.
Which is stiffer, FDM HIPS or FDM Polycarbonate?
FDM Polycarbonate is stiffer: Young's modulus 2.39 GPa against 1.59 GPa for FDM HIPS, so the same part in FDM Polycarbonate deflects less under the same load.
Which is lighter for the same job, FDM HIPS or FDM Polycarbonate?
For the same stiffness or strength: FDM HIPS is lighter for a stiff panel or plate; FDM Polycarbonate is lighter for a stiff rod or tie (tension), stiff beam (bending), strong rod or tie, strong beam, strong panel or plate.
Part that must be
FDM HIPS
FDM Polycarbonate
Stiff rod or tie (tension)
30% heavier
lighter
Stiff beam (bending)
6% heavier
lighter
Stiff panel or plate
lighter
1% heavier
Strong rod or tie
2.49x heavier
lighter
Strong beam
1.75x heavier
lighter
Strong panel or plate
46% heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, FDM HIPS or FDM Polycarbonate?
FDM Polycarbonate stretches further before it breaks: 9.2% elongation at break against 1.4% for FDM HIPS.
Thermal
Which conducts heat better, FDM HIPS or FDM Polycarbonate?
FDM Polycarbonate conducts heat better: 0.2 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
FDM Polycarbonate expands less: 65 µm/m·K against 80 µm/m·K for FDM HIPS.