Materials / Compare

DMLS AlSi10Mg Aluminum vs. PCB Laminate FR-4

Compare DMLS AlSi10Mg Aluminum vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.

DMLS AlSi10Mg Aluminum3D printed metal (DMLS)
PCB Laminate FR-4Composite
MechanicalDMLS AlSi10Mg AluminumPCB Laminate FR-4
Yield strength270MPa1not given (tensile used)
Ultimate tensile strength450MPa1246–385MPa2
Flexural strengthnot sourced531–621MPa2
Elongation at break10.2%1not sourced
Young's modulus (stiffness)72GPa321.9–25.8GPa2
Density2,670kg/m³41,920kg/m³539% lighter
Strength to weight101kN·m/kg164kN·m/kg1.62x higher
Stiffness to weight27MN·m/kg2.17x higher12.4MN·m/kg
Poisson's ratiobase material0.3360.171–0.1772
Shear modulus27.1GPa2.66x stiffer in shear10.2GPa
Bulk modulus70.6GPa5.79x higher12.2GPa
Speed of sound5,193m/s47% faster3,525m/s
1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLS PA12 NylonDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteSiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS AlSi10Mg AluminumPCB Laminate FR-4
Stiffness against densityHigher and further left: stiffer for its weight
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin StandardSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickSiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS AlSi10Mg AluminumPCB Laminate FR-4
Strength against densityHigher and further left: stronger for its weight
ThermalDMLS AlSi10Mg AluminumPCB Laminate FR-4
Thermal conductivity110W/m·K1275x more heat through a fin0.4W/m·K2
Thermal expansionmean 25-100 °C20µm/m·K113–14µm/m·K2
100 mm part over a 50 °C swing100µm growth67.5µm growth48% less
Specific heatbase material963J/kg·K61,200–1,400J/kg·K5
Heats up and cools (diffusivity)42.8mm²/s267x faster0.16mm²/s
Thermal shock resistance13,819W/m42.7x more resistant324W/m
Glass transitionnot sourced180°C2
Max service temperaturenot sourced130°C2
1k10k0.1110100Density (kg/m³)Thermal conductivity (W/m·K)Plastic PLAPlastic PETGPlastic ABSPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickSiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS AlSi10Mg AluminumPCB Laminate FR-4
Thermal conductivity against densityHigher and further left: spreads more heat for its weight
0.111010010100Thermal conductivity (W/m·K)Thermal expansion (µm/m·K)Plastic PETGPlastic ABSPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM HIPSSLA Resin StandardDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPlywoodSiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS AlSi10Mg AluminumPCB Laminate FR-4
Thermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources6 documents: EOS GmbH, Isola, Renishaw, Park Electrochemical (Nelco), U.S. Department of Defense
DMLS AlSi10Mg Aluminum
EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10
PCB Laminate FR-4
Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material.
  1. 1
    EOS Aluminium AlSi10Mg Material Data SheetEOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Yield strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Ultimate tensile strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Elongation at break: typical at break, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Thermal conductivity: typical, as manufactured, horizontal (ISO 22007-2)DMLS AlSi10Mg Aluminum · Thermal expansion: mean 25-100 °C, ASTM E228
  2. 2
    370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Laminate FR-4 · Ultimate tensile strength: typical, in-plane: cross direction .. length direction (ASTM D3039)PCB Laminate FR-4 · Flexural strength: typical: cross direction .. length direction (IPC-TM-650 2.4.4B)PCB Laminate FR-4 · Young's modulus (stiffness): typical, in-plane: cross direction .. length direction (ASTM D790-15e2)PCB Laminate FR-4 · Poisson's ratio: typical, in-plane: cross direction .. length directionPCB Laminate FR-4 · Thermal conductivity: typical (ASTM E1952); direction not stated by the sheetPCB Laminate FR-4 · Thermal expansion: typical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)PCB Laminate FR-4 · Glass transition: typical, DSC (IPC-TM-650 2.4.25C)PCB Laminate FR-4 · Max service temperature: UL Relative Thermal Index (UL 796)
  3. 3
    RenAM 500 Series Aluminium AlSi10Mg Material Data SheetRenishawDMLS AlSi10Mg Aluminum · Young's modulus (stiffness): same material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY)
  4. 4
    EOS Aluminium AlSi10Mg Material Data Sheet, FlexLine, M 290 (2018)EOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Density: typical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm)
  5. 5
    N4000-6 Laminate Data Sheet (2006)Park Electrochemical (Nelco)archived copyPCB Laminate FR-4 · Density: typical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HRPCB Laminate FR-4 · Specific heat: typical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR
  6. 6
    MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseDMLS AlSi10Mg Aluminum · Poisson's ratio: base material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000)DMLS AlSi10Mg Aluminum · Specific heat: base material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Mechanical

Is DMLS AlSi10Mg Aluminum stronger than PCB Laminate FR-4?

PCB Laminate FR-4 is stronger: its tensile strength is 315 MPa against yield strength 270 MPa for DMLS AlSi10Mg Aluminum (17%).

Which is lighter, DMLS AlSi10Mg Aluminum or PCB Laminate FR-4?

PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 2,670 kg/m³ for DMLS AlSi10Mg Aluminum.

Which is stiffer, DMLS AlSi10Mg Aluminum or PCB Laminate FR-4?

DMLS AlSi10Mg Aluminum is stiffer: Young's modulus 72 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in DMLS AlSi10Mg Aluminum deflects less under the same load.

Which is lighter for the same job, DMLS AlSi10Mg Aluminum or PCB Laminate FR-4?

For the same stiffness or strength: DMLS AlSi10Mg Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate; PCB Laminate FR-4 is lighter for a strong rod or tie, strong beam, strong panel or plate.

Part that must beDMLS AlSi10Mg AluminumPCB Laminate FR-4
Stiff rod or tie (tension)lighter2.17x heavier
Stiff beam (bending)lighter25% heavier
Stiff panel or platelighter4% heavier
Strong rod or tie1.62x heavierlighter
Strong beam1.54x heavierlighter
Strong panel or plate1.5x heavierlighter

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Thermal

Which conducts heat better, DMLS AlSi10Mg Aluminum or PCB Laminate FR-4?

DMLS AlSi10Mg Aluminum conducts heat better: 110 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.

Which expands less with temperature?

PCB Laminate FR-4 expands less: 13.5 µm/m·K against 20 µm/m·K for DMLS AlSi10Mg Aluminum.

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