Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Try it on a partA sample part to run stress or thermal on, free in your browser
Sources4 documents: Kaiser Aluminum, Isola, Park Electrochemical (Nelco), U.S. Department of Defense
Aluminum 7050-T7451
7050-T7451 plate, Kaiser Aluminum sheet, coil & plate typical datasheet (longitudinal); Poisson from MIL-HDBK-5J
PCB Laminate FR-4
Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material.
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Laminate FR-4 · Ultimate tensile strength: typical, in-plane: cross direction .. length direction (ASTM D3039)PCB Laminate FR-4 · Flexural strength: typical: cross direction .. length direction (IPC-TM-650 2.4.4B)PCB Laminate FR-4 · Young's modulus (stiffness): typical, in-plane: cross direction .. length direction (ASTM D790-15e2)PCB Laminate FR-4 · Poisson's ratio: typical, in-plane: cross direction .. length directionPCB Laminate FR-4 · Thermal conductivity: typical (ASTM E1952); direction not stated by the sheetPCB Laminate FR-4 · Thermal expansion: typical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)PCB Laminate FR-4 · Glass transition: typical, DSC (IPC-TM-650 2.4.25C)PCB Laminate FR-4 · Max service temperature: UL Relative Thermal Index (UL 796)
3
N4000-6 Laminate Data Sheet (2006)Park Electrochemical (Nelco)archived copyPCB Laminate FR-4 · Density: typical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HRPCB Laminate FR-4 · Specific heat: typical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR
4
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseAluminum 7050-T7451 · Poisson's ratio: typical (handbook physical constant)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum 7050-T7451 stronger than PCB Laminate FR-4?
Aluminum 7050-T7451 is stronger: its yield strength is 469 MPa against tensile strength 315 MPa for PCB Laminate FR-4 (49%).
Which is lighter, Aluminum 7050-T7451 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 2,830 kg/m³ for Aluminum 7050-T7451.
Which is stiffer, Aluminum 7050-T7451 or PCB Laminate FR-4?
Aluminum 7050-T7451 is stiffer: Young's modulus 70.3 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Aluminum 7050-T7451 deflects less under the same load.
Which is lighter for the same job, Aluminum 7050-T7451 or PCB Laminate FR-4?
For the same stiffness or strength: Aluminum 7050-T7451 is lighter for a stiff rod or tie (tension), stiff beam (bending); PCB Laminate FR-4 is lighter for a stiff panel or plate, strong beam, strong panel or plate.
Part that must be
Aluminum 7050-T7451
PCB Laminate FR-4
Stiff rod or tie (tension)
lighter
2x heavier
Stiff beam (bending)
lighter
16% heavier
Stiff panel or plate
3% heavier
lighter
Strong rod or tie
about equal
about equal
Strong beam
13% heavier
lighter
Strong panel or plate
21% heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Aluminum 7050-T7451 or PCB Laminate FR-4?
Aluminum 7050-T7451 conducts heat better: 157 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 23.5 µm/m·K for Aluminum 7050-T7451.