Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Sources2 documents: Copper Development Association, Wieland
Values for
Wrought. C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
1
C12200 Alloy (copper.org)Copper Development Associationarchived copyYield strength: typical, 0.5% extension under load, 0.065 in. tubeUltimate tensile strength: typical, 0.065 in. tubeElongation at break: typical, 0.065 in. tubeYoung's modulus (stiffness): typicalDensity: nominalThermal conductivity: typical, 20 °CThermal expansion: typical, mean 20-100 °CSpecific heat: typical, 20 °CMelting point: liquidus
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Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyPoisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
Copper C12200 has a thermal conductivity of 339 W/m·K (196 BTU/hr·ft·°F). Basis: typical, 20 °C. Source: Copper Development Association, C12200 Alloy (copper.org)archived copy.
Specific heat of Copper C12200
The specific heat capacity of Copper C12200 is 385 J/kg·K (0.092 BTU/lb·°F). Basis: typical, 20 °C. Source: Copper Development Association, C12200 Alloy (copper.org)archived copy.
Coefficient of thermal expansion of Copper C12200
Copper C12200 expands 16.9 µm/m·K (9.39 µin/in·°F): a 100 mm part grows 84.5 µm over a 50 °C rise. Basis: typical, mean 20-100 °C. Source: Copper Development Association, C12200 Alloy (copper.org)archived copy.
Thermal diffusivity of Copper C12200
Computed from the conductivity, density and specific heat (k / ρc): 98.5 mm²/s, how fast a temperature change spreads through it.
Melting point of Copper C12200
Copper C12200 melts at 1,083 °C (1,981 °F). Basis: liquidus. Source: Copper Development Association, C12200 Alloy (copper.org)archived copy.