Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Sources2 documents: Copper Development Association, Wieland
Values for
Wrought. C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values
1
C11000 Alloy (copper.org)Copper Development Associationarchived copyYield strength: typical, 0.5% extension under loadUltimate tensile strength: typicalElongation at break: typical, 1 in. rodYoung's modulus (stiffness): typicalDensity: nominalThermal conductivity: typical, 20 °CThermal expansion: typical, mean 20-100 °CSpecific heat: typical, 20 °CMelting point: solidus-liquidus
2
Wieland-K32 (Cu-ETP, C11000) Data SheetWielandarchived copyPoisson's ratio: reference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products)
Copper C110 has a thermal conductivity of 391 W/m·K (226 BTU/hr·ft·°F). Basis: typical, 20 °C. Source: Copper Development Association, C11000 Alloy (copper.org)archived copy.
Specific heat of Copper C110
The specific heat capacity of Copper C110 is 385 J/kg·K (0.092 BTU/lb·°F). Basis: typical, 20 °C. Source: Copper Development Association, C11000 Alloy (copper.org)archived copy.
Coefficient of thermal expansion of Copper C110
Copper C110 expands 16.9 µm/m·K (9.39 µin/in·°F): a 100 mm part grows 84.5 µm over a 50 °C rise. Basis: typical, mean 20-100 °C. Source: Copper Development Association, C11000 Alloy (copper.org)archived copy.
Thermal diffusivity of Copper C110
Computed from the conductivity, density and specific heat (k / ρc): 114 mm²/s, how fast a temperature change spreads through it.
Melting point of Copper C110
Copper C110 melts at 1,065–1,083 °C (1,949–1,981 °F). Basis: solidus-liquidus. Source: Copper Development Association, C11000 Alloy (copper.org)archived copy.