FDM HIPS vs. SLA Resin Tough 2000

Compare FDM HIPS vs. SLA Resin Tough 2000 strength, stiffness, weight and thermal properties.

FDM HIPS3D printed (FDM)

SLA Resin Tough 20003D printed (SLA resin)

Mechanical	FDM HIPS	SLA Resin Tough 2000
Yield strength	not given (tensile used)	40.4MPa1
Ultimate tensile strength	18.4MPa2	40.4MPa12.2x stronger
Flexural strength	31.8MPa2	67MPa12.11x stronger in bending
Elongation at break	1.4%2	79%156.4x more ductile
Young's modulus (stiffness)	1.59GPa2	1.8GPa113% stiffer
Density	1,023kg/m³2	1,090kg/m³1
Strength to weight	18kN·m/kg	37.1kN·m/kg2.06x higher
Stiffness to weight	1.55MN·m/kg	1.65MN·m/kg6% higher
Poisson's ratio	not sourced	not sourced
Shear modulus	not sourced	not sourced
Bulk modulus	not sourced	not sourced
Speed of sound	1,246m/s	1,285m/s3% faster

Stiffness against densityHigher and further left: stiffer for its weight

Strength against densityHigher and further left: stronger for its weight

Thermal	FDM HIPS	SLA Resin Tough 2000
Thermal conductivity	base material0.17W/m·K3	not sourced
Thermal expansion	base material80µm/m·K31.68x less	mean 0-150 °C134µm/m·K1
100 mm part over a 50 °C swing	400µm growth1.68x less	671µm growth
Specific heat	not sourced	not sourced
Heats up and cools (diffusivity)	not sourced	not sourced
Thermal shock resistance	not sourced	not sourced
Glass transition	99°C2	DMA112°C113.2 °C higher
Max service temperature	HDT 1.8 MPa86°C229 °C hotter	HDT 1.8 MPa57°C1

Thermal conductivity against densityHigher and further left: spreads more heat for its weight

Thermal expansion against thermal conductivityLower and further right: warps less when heated

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Sources3 documents: Formlabs, BASF Forward AM, INEOS Styrolution

FDM HIPS: BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
SLA Resin Tough 2000: Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated.

1
Tough 2000 Resin V2 Technical Data Sheet (2025)Formlabsarchived copySLA Resin Tough 2000 · Yield strength: typicalSLA Resin Tough 2000 · Ultimate tensile strength: typicalSLA Resin Tough 2000 · Flexural strength: typicalSLA Resin Tough 2000 · Elongation at break: typicalSLA Resin Tough 2000 · Young's modulus (stiffness): typicalSLA Resin Tough 2000 · Density: typicalSLA Resin Tough 2000 · Thermal expansion: mean 0-150 °CSLA Resin Tough 2000 · Glass transition: DMASLA Resin Tough 2000 · Max service temperature: HDT 1.8 MPa
2
Ultrafuse HiPS Technical Data Sheet, v2.2 (2019)BASF Forward AMarchived copyFDM HIPS · Ultimate tensile strength: typicalFDM HIPS · Flexural strength: typicalFDM HIPS · Elongation at break: typicalFDM HIPS · Young's modulus (stiffness): typicalFDM HIPS · Density: typicalFDM HIPS · Glass transition: typicalFDM HIPS · Max service temperature: HDT 1.8 MPa
3
Styrolution PS 486N (HIPS) Product Data SheetINEOS StyrolutionFDM HIPS · Thermal conductivity: base material: INEOS Styrolution PS 486N injection-molding HIPS, typicalFDM HIPS · Thermal expansion: base material: INEOS Styrolution PS 486N injection-molding HIPS, typical

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

FDM HIPS and SLA Resin Tough 2000 are 3D printed: their properties depend on build direction and print settings; these are typical values.

Questions

Mechanical

Is FDM HIPS stronger than SLA Resin Tough 2000?

SLA Resin Tough 2000 is stronger: its yield strength is 40.4 MPa against tensile strength 18.4 MPa for FDM HIPS (2.2x).

Which is lighter, FDM HIPS or SLA Resin Tough 2000?

FDM HIPS is lighter: 1,023 kg/m³ against 1,090 kg/m³ for SLA Resin Tough 2000.

Which is stiffer, FDM HIPS or SLA Resin Tough 2000?

SLA Resin Tough 2000 is stiffer: Young's modulus 1.8 GPa against 1.59 GPa for FDM HIPS, so the same part in SLA Resin Tough 2000 deflects less under the same load.

Which is lighter for the same job, FDM HIPS or SLA Resin Tough 2000?

For the same stiffness or strength: FDM HIPS is lighter for a stiff panel or plate; SLA Resin Tough 2000 is lighter for a stiff rod or tie (tension), strong rod or tie, strong beam, strong panel or plate.

Part that must be	FDM HIPS	SLA Resin Tough 2000
Stiff rod or tie (tension)	6% heavier	lighter
Stiff beam (bending)	about equal	about equal
Stiff panel or plate	lighter	2% heavier
Strong rod or tie	2.06x heavier	lighter
Strong beam	1.59x heavier	lighter
Strong panel or plate	39% heavier	lighter

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which is more ductile, FDM HIPS or SLA Resin Tough 2000?

SLA Resin Tough 2000 stretches further before it breaks: 79% elongation at break against 1.4% for FDM HIPS.

Thermal

Which handles higher temperatures, FDM HIPS or SLA Resin Tough 2000?

FDM HIPS does: 86 °C against 57 °C for SLA Resin Tough 2000, both HDT 1.8 MPa.

Which expands less with temperature?

FDM HIPS expands less: 80 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.