Materials / Compare

FDM HIPS vs. Plastic UHMWPE

Compare FDM HIPS vs. Plastic UHMWPE strength, stiffness, weight and thermal properties.

FDM HIPS3D printed (FDM)
Plastic UHMWPEBulk polymer (molded or machined)
MechanicalFDM HIPSPlastic UHMWPE
Yield strengthnot given (tensile used)20MPa1
Ultimate tensile strength18.4MPa243MPa1
Flexural strength31.8MPa2not sourced
Elongation at break1.4%2465%1332x more ductile
Young's modulus (stiffness)1.59GPa22.41x stiffer0.66GPa1
Density1,023kg/m³2930kg/m³1
Strength to weight18kN·m/kg21.5kN·m/kg20% higher
Stiffness to weight1.55MN·m/kg2.19x higher0.71MN·m/kg
Poisson's rationot sourcednot sourced
Shear modulusnot sourcednot sourced
Bulk modulusnot sourcednot sourced
Speed of sound1,246m/s48% faster842m/s
1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFSLA Resin StandardSLA Resin Tough 2000SLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcretePCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30FDM HIPSPlastic UHMWPE
Stiffness against densityHigher and further left: stiffer for its weight
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFSLA Resin StandardSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30FDM HIPSPlastic UHMWPE
Strength against densityHigher and further left: stronger for its weight
ThermalFDM HIPSPlastic UHMWPE
Thermal conductivitybase material0.17W/m·K30.4W/m·K42.35x more heat through a fin
Thermal expansionbase material80µm/m·K32.5x less200µm/m·K4
100 mm part over a 50 °C swing400µm growth2.5x less1,000µm growth
Specific heatnot sourcednot sourced
Heats up and cools (diffusivity)not sourcednot sourced
Thermal shock resistancenot sourcednot sourced
Melting pointnot sourcedDSC 10 K/min130–138°C1
Glass transition99°C2not sourced
Max service temperatureHDT 1.8 MPa86°C280°C1
1k10k0.1110100Density (kg/m³)Thermal conductivity (W/m·K)Plastic PLAPlastic PETGPlastic ABSPlastic NylonRubberWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30FDM HIPSPlastic UHMWPE
Thermal conductivity against densityHigher and further left: spreads more heat for its weight
0.111010010100Thermal conductivity (W/m·K)Thermal expansion (µm/m·K)Plastic PETGPlastic ABSPlastic NylonWoodAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110Copper C10100Copper C12200GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateSLA Resin StandardDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelConcreteBrickPlywoodPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum 3003-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30FDM HIPSPlastic UHMWPE
Thermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Celanese, BASF Forward AM, INEOS Styrolution
FDM HIPS
BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
Plastic UHMWPE
Celanese GUR 4120 (avg. molecular weight 4.7x10^6 g/mol), typical values on compression-molded specimens; CTE and thermal conductivity from Celanese's generic UHMWPE guide (grade not named)
  1. 1
    GUR UHMW-PE Overview (GUR-015)CelanesePlastic UHMWPE · Yield strength: typical, tensile stress at yield ISO 527, 50 mm/minPlastic UHMWPE · Ultimate tensile strength: typical, tensile stress at break ISO 527, 50 mm/minPlastic UHMWPE · Elongation at break: typical, nominal elongation at break ISO 527Plastic UHMWPE · Young's modulus (stiffness): typical, tensile modulus ISO 527, 1 mm/minPlastic UHMWPE · Density: typicalPlastic UHMWPE · Melting point: DSC 10 K/minPlastic UHMWPE · Max service temperature: recommended max constant operating temperature
  2. 2
    Ultrafuse HiPS Technical Data Sheet, v2.2 (2019)BASF Forward AMarchived copyFDM HIPS · Ultimate tensile strength: typicalFDM HIPS · Flexural strength: typicalFDM HIPS · Elongation at break: typicalFDM HIPS · Young's modulus (stiffness): typicalFDM HIPS · Density: typicalFDM HIPS · Glass transition: typicalFDM HIPS · Max service temperature: HDT 1.8 MPa
  3. 3
    Styrolution PS 486N (HIPS) Product Data SheetINEOS StyrolutionFDM HIPS · Thermal conductivity: base material: INEOS Styrolution PS 486N injection-molding HIPS, typicalFDM HIPS · Thermal expansion: base material: INEOS Styrolution PS 486N injection-molding HIPS, typical
  4. 4
    GUR UHMW-PE Polymer Guide (GUR-003)Celanesearchived copyPlastic UHMWPE · Thermal conductivity: typical, unfilled (narrative value, generic Celanese UHMWPE)Plastic UHMWPE · Thermal expansion: typical, 20 to 100 °C (generic Celanese UHMWPE)

Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Mechanical

Is FDM HIPS stronger than Plastic UHMWPE?

Plastic UHMWPE is stronger: its yield strength is 20 MPa against tensile strength 18.4 MPa for FDM HIPS (9%).

Which is lighter, FDM HIPS or Plastic UHMWPE?

Plastic UHMWPE is lighter: 930 kg/m³ against 1,023 kg/m³ for FDM HIPS.

Which is stiffer, FDM HIPS or Plastic UHMWPE?

FDM HIPS is stiffer: Young's modulus 1.59 GPa against 0.66 GPa for Plastic UHMWPE, so the same part in FDM HIPS deflects less under the same load.

Which is lighter for the same job, FDM HIPS or Plastic UHMWPE?

For the same stiffness or strength: FDM HIPS is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate; Plastic UHMWPE is lighter for a strong rod or tie, strong beam, strong panel or plate.

Part that must beFDM HIPSPlastic UHMWPE
Stiff rod or tie (tension)lighter2.19x heavier
Stiff beam (bending)lighter41% heavier
Stiff panel or platelighter22% heavier
Strong rod or tie20% heavierlighter
Strong beam16% heavierlighter
Strong panel or plate15% heavierlighter

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which is more ductile, FDM HIPS or Plastic UHMWPE?

Plastic UHMWPE stretches further before it breaks: 465% elongation at break against 1.4% for FDM HIPS.

Thermal

Which conducts heat better, FDM HIPS or Plastic UHMWPE?

Plastic UHMWPE conducts heat better: 0.4 W/m·K against 0.17 W/m·K for FDM HIPS.

Which expands less with temperature?

FDM HIPS expands less: 80 µm/m·K against 200 µm/m·K for Plastic UHMWPE.

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