Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Sources2 documents: Copper Development Association, Wieland
Values for
Wrought. C36000 free-cutting brass, H02 half-hard rod 1 in. section (20% cold work), copper.org typical values
1
C36000 Alloy (copper.org)Copper Development Associationarchived copyYield strength: typical, 0.5% extension under loadUltimate tensile strength: typicalElongation at break: typical, 1 in. rodYoung's modulus (stiffness): typical, temper-independentDensity: nominalThermal conductivity: typical, 20 °CThermal expansion: typical, mean 20-300 °CSpecific heat: typical, 20 °CMelting point: solidus-liquidus
2
Wieland-Z30 (CuZn39Pb2, C37700) Data SheetWielandarchived copyPoisson's ratio: base material: leaded free-machining brass CuZn39Pb2 (C37700), Wieland-Z30 rolled products, reference value at room temperature
Brass C360 has a thermal conductivity of 116 W/m·K (67 BTU/hr·ft·°F). Basis: typical, 20 °C. Source: Copper Development Association, C36000 Alloy (copper.org)archived copy.
Specific heat of Brass C360
The specific heat capacity of Brass C360 is 377 J/kg·K (0.09 BTU/lb·°F). Basis: typical, 20 °C. Source: Copper Development Association, C36000 Alloy (copper.org)archived copy.
Coefficient of thermal expansion of Brass C360
Brass C360 expands 20.5 µm/m·K (11.4 µin/in·°F): a 100 mm part grows 103 µm over a 50 °C rise. Basis: typical, mean 20-300 °C. Source: Copper Development Association, C36000 Alloy (copper.org)archived copy.
Thermal diffusivity of Brass C360
Computed from the conductivity, density and specific heat (k / ρc): 36.2 mm²/s, how fast a temperature change spreads through it.
Melting point of Brass C360
Brass C360 melts at 888–899 °C (1,630–1,650 °F). Basis: solidus-liquidus. Source: Copper Development Association, C36000 Alloy (copper.org)archived copy.